When will TSMC use High NA EUV?

TSMC plans to use ASML's High NA EUV in high-volume manufacturing for advanced nodes starting in 2030, according to its 8 September 2026 joint release with ASML.

What is the TSMC and ASML photomask initiative?

A plan announced on 8 September 2026 to move EUV lithography from 6-inch to 12-inch photomasks, with a pilot line by 2031 and production use by 2033.

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Semiconductor foundry

TSMC

TSMC (Taiwan Semiconductor Manufacturing Company) is the Hsinchu-based contract chipmaker founded in 1987 that manufactures chips for many AI hardware designers; the compute die of Microsoft's Maia 300 accelerator, for example, is made on TSMC N2P. It is listed in Taipei and on the New York Stock Exchange, and C.C. Wei is chairman and CEO.

Last reviewed 28 Oct 2026

Facts at a glance

Type	Semiconductor foundry
Founded	1987
Headquarters	Hsinchu, Taiwan
Listings	Taiwan Stock Exchange (2330) and NYSE (TSM) source
Chairman and CEO	C.C. Wei source
High NA EUV plan	High-volume manufacturing for advanced nodes starting in 2030 source
Microsoft Maia 300	Compute die made on TSMC N2P source

Questions people ask

When will TSMC use High NA EUV?: TSMC plans to use ASML's High NA EUV in high-volume manufacturing for advanced nodes starting in 2030, according to its 8 September 2026 joint release with ASML.
What is the TSMC and ASML photomask initiative?: A plan announced on 8 September 2026 to move EUV lithography from 6-inch to 12-inch photomasks, with a pilot line by 2031 and production use by 2033.